氧化铝陶瓷基板

描述

氧化铝陶瓷基板(Alumina Ceramic Substrate)

氧化铝(Al₂O₃)陶瓷基板因其成熟的制备工艺、良好的性价比和广泛的适用性,在电子和工业领域被广泛采用。其热导率适中,约为 20–26 W/m·K,适合多种热管理和绝缘应用场景。

氧化铝陶瓷基板的物理性能

性能参数 数值说明
材料组成 Al₂O₃
纯度等级 96%、99%、99.5%
密度(g/cm³) 3.78
莫氏硬度 9.2
热导率(W/m·K) 26
热膨胀系数(×10⁻⁶/°C) 7.2
介电常数(1 MHz) 9.6
抗弯强度(N/mm²) 380
介质损耗角正切(@1 MHz) 3.0 × 10⁻⁴

产品规格

  • 标准尺寸:100 × 100 × 1.0 mm

  • 尺寸定制:支持按客户需求加工各种规格

  • 表面处理:抛光表面,表面粗糙度 Ra < 0.01 µm

该材料兼具优异的机械强度、热稳定性和介电性能,广泛应用于电子封装、热管理模块、绝缘支架、结构部件等高性能领域。

如需样品或进一步技术资料,欢迎联系苏州科跃材料科技有限公司。

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常见问题

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.